Pay in 4 interest-free payments of $3.27 Learn more
Ships within 48 hours · Estimated delivery Sep 7 - Sep 12
Temperature range: 0~130℃
Speed regulation: Stepless speed regulation
less than 2/3 of the height of the phone
0 version for Mobile Phone Repair (one account can be used on three computers simultaneously
Product Color: White and Gray
MIJING MS1-MINI Chip Glue Removal Table Heating Platform BGA Soldering Station Temperature range: 0~130℃MIJING MS1 MINI Chip Glue Removal Table for heating and removing glue from mobile phone CPU RAM, NAND, eMMC, SSD, WIFI, and BGA chips without using hot air gun and soldering iron. Mijing MS1 MINI glue removal desoldering station, rapid heating, one button adjustment, easy and simple operation. Features: Rapid Heating: Adjustable temperature range (160C250C) for precise control. Efficient Heat Conduction: Aluminum substrate ensures fast and even
