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textile inspection
12mm SR2ZY/EN/EM CPU BGA reballing stencil plant tin steel net
H300 HDMI Industrial Video Microscope Camera For Cell Phone Soldering Repair
Note: Use 0
Tweezers storage module : Storage tweezers with various width
MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZ25 0.20mm textile inspectionMECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,
